Accelerating the Development and Application of Optical I/O in AI/ML Architectures with NVIDIA

News

Lumentum And Ayar Labs Announce Strategic Collaboration to Produce External Lasers

News

Hewlett Packard Enterprise and Ayar Labs Announce Strategic Collaboration and Investment

Blog

Collaborating with GlobalFoundries® to Develop Fotonix Next-Gen Silicon Photonics Process

Revolutionizing Chip-to-Chip Communication

Ayar Labs is disrupting the traditional performance, cost, and efficiency curves of the semiconductor and computing industries by delivering up to a 1000x improvement in interconnect bandwidth density at one-tenth the power. We use standard CMOS processing to develop high-speed, high-density, low-power optical interconnect “chiplets” and lasers to replace traditional electrical I/O.

Cloud

→ Disaggregated Architectures

→ Glue-less interconnects

→ Memory semantic fabrics

AI/HPC

→ Chip-Chip low latency

→ Bandwidth

→ HBM Capacity

Connectivity

→ Disaggregated base stations

→ RF-Optical I/O

→ Digital Beam Forming

Intelligent Edge

→ RF Sensing

→ Phased Array Radar

→ AI at the edge

In-Package Optical I/O: Unleashing Innovation

Discover how Ayar Labs’ optical I/O solution is the key to unleashing innovation in AI, scaling cloud and HPC, launching new aerospace systems, enabling the next wave of 5G, and more.

Technical Brief:

Optical I/O Chiplets Eliminate Bottlenecks to Unleash Innovation

This technical brief examines the evolution of optical communications in computing systems and the transition to ‘Phase Two’ of Moore’s Law through in-package optical I/O (OIO). Increasing demand for artificial intelligence, high-performance computing, aerospace data collection and communication, hyper-scale data centers, disaggregated memory, and storage has led to the development of a variety of powerful, high-throughput, system-on-chip (SoC) solutions that redefine traditional computing architectures.

Download this technical brief to learn how Ayar Labs TeraPHY™ Optical I/O Chiplets are enabling better bandwidth and better latency chip to chip communications at lower power.

CW-WDM MSA

The CW-WDM MSA Consortium Releases New Specification for Multi-Wavelength Optical Laser Sources

Learn more about the specification →

Industry’s First Terabit Optical Link

Technical Paper

An Error-free 1 Tbps WDM Optical I/O Chiplet and Multi-wavelength Multi-port Laser

In this paper we demonstrate a 128 Gbps/port (8-λ×16 Gbps/λ) natively error-free transmission across eight optical ports using a 8-port, 8-λ/port WDM remote laser source and a pair of monolithically integrated CMOS optical I/O chiplets with 4.96-5.56 pJ/bit optical Tx+Rx chiplet energy efficiency.

Video Demonstration

Request your Optical I/O Starter Kit Today

Become a part of the I/O revolution and begin evaluating optical I/O for your next generation SoC architectures now with the Ayar Labs Optical I/O Starter Kit.  The kit includes everything you need and can be customized to meet your product requirements.

Recent Announcements

In the Media

Ayar Labs preps for an optical I/O reckoning

Ayar Labs is continuing the long, storied tradition in telecom of replacing copper wires with fiber optics and using light instead of electricity to transmit data. The difference is that Ayar Labs is replacing copper connections at the chip level, speeding up...

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Latest Resources

Demo of the SuperNova™ Light Source Operating from 15-100°C

Ayar Labs demonstrates the industry’s first continuous wave, CW-WDM MSA compliant, 8 wavelength, 8 port optical source operating from 15 to 100°C on a 400 GHz wavelength grid.  Learn more about the SuperNova light source for optical I/O, AI, optical computing and...

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