Enabling the next phase of Moore’s Law through optical connectivity
Ayar Labs solves I/O bandwidth and power bottlenecks by moving data using light.
Revolutionizing Chip-to-Chip Communication
Ayar Labs is disrupting the traditional performance, cost, and efficiency curves of the semiconductor and computing industries by delivering up to a 1000x improvement in interconnect bandwidth density at one-tenth the power. We use standard CMOS processing to develop high-speed, high-density, low-power optical interconnect “chiplets” and lasers to replace traditional electrical I/O.
→ Disaggregated architectures
→ Glue-less interconnects
→ Memory semantic fabrics
→ Chip-chip low latency
→ HBM capacity
→ Disaggregated base stations
→ RF-optical I/O
→ Digital beam forming
→ RF sensing
→ Phased array radar
→ AI at the edge
2024 IEEE International Solid-State Circuits Conference (ISSCC)
February 18 – 22, 2024 | San Francisco, CA
Ayar Labs at ISSCC 2024
Photonics for Die-to-Die Interconnects: Links and Optical I/O Chiplets | Chen Sun, VP Silicon Engineering and Co-Founder
March 18 – 21, 2024 | Charleston, SC
Ayar Labs at GOMACTech 2024
Session 36: Co-Packaged Analog-Drive High-Bandwidth Optical Input/Output (KANAGAWA)
36.2: Optical Assembly Challenges and Opportunities in Silicon Photonics Optical I/O Chiplets | Chong Zhang, Director, Packaging Engineering, Ayar Labs
36.3: Advancements in Co-Packaged Optics Technology: Integrated Optical I/O and FPGAs for New Platform Architectures | Intel Corporation + Ayar Labs
Ayar Labs Adds Silicon Industry Veterans to Accelerate Growth
Microchip Tech CEO Ganesh Moorthy and Tech Entrepreneur Craig Barratt Join Board of Directors, Company Appoints Vladimir Stojanovic as CTO.
In-Package Optical I/O for Generative AI Architectures
This solution brief explores the needs of near-future generative AI architectures, as well as how optical I/O can help solve some of the problems currently facing industry leaders.
Have You Seen the
Chip-to-chip communication is advancing at the speed of light. Are you keeping up?
Discover how HPE, Intel, Lockheed, NVIDIA, Raytheon, and others are looking to in-package optical I/O to ramp up data movement, build disaggregated architectures, and get that next million-X speed-up in AI.
Optical I/O Delivers Unprecedented Throughput and System Scale-Out for HPC
Hyperion Research: Strong Market Sentiment for Optical I/O Connectivity
Explore key findings from Hyperion’s study on market readiness and expectations for optical I/O based on HPC/AI user and vendor input.
Breaking the HPC I/O Bottleneck with Optical Interconnects
Improving performance, memory capacity, and latency in HPC/AI system architectures is essential to reduce power consumption and costs as well as accelerate critical processing tasks.
Optical I/O Enables Disaggregated Architectures for HPC, AI, and Cloud
Disaggregated architectures, made possible by optical I/O, enable resource composability for more efficient utilization in cloud, AI, and HPC.
Rethinking Generative AI Architectures with Optical I/O
Ayar Labs Optical I/O: Shattering the Barriers to AI at Scale
Generative AI is enabling transformative outcomes, but model complexity is growing exponentially. Traditional interconnects create a bottleneck for data, forcing GPUs to remain idle a majority of the time. We need a new approach to generative AI architecture: optically connect nodes at scale so they effectively work like a single, giant GPU.
Ayar Labs: Solving Data Bottlenecks with Optical I/O
Ayar Labs is solving the critical performance bottlenecks in computing systems with optical I/O. By moving data between computer chips using light instead of electricity, systems achieve a dramatic leap in performance and latency with much lower power.
In-Package Optical I/O: Unleashing Innovation
Discover how Ayar Labs’ optical I/O solution is the key to unleashing innovation in AI, scaling cloud and HPC, launching new aerospace systems, enabling the next wave of 5G, and more.
Microchip Tech CEO Ganesh Moorthy and Tech Entrepreneur Craig Barratt Join Board of Directors, Company Appoints Vladimir Stojanovic as CTO..
In the Media
This brief explores the impact of generative AI, as well as how optical I/O helps solve some of the problems facing the industry.
Join us as we unravel the challenges in existing hardware and system architectures, showcasing innovations that bolster AI’s efficiency, scalability, and sustainability.
Anil Rao, VP & GM Systems Architecture & Engineering, Intel: Pushing the envelope with optical I/O.
Generative AI is enabling transformative outcomes, but model complexity is growing exponentially. Traditional interconnects create a bottleneck for data, forcing GPUs to remain idle a majority of the time.