Enabling the next phase of Moore’s Law through optical connectivity

Ayar Labs solves the I/O bandwidth and power bottlenecks by moving data using light.

Dramatically improving I/O performance at lower power

Enabling new system architectures and topologies

Improving resiliency and reach

Ayar Labs is disrupting the traditional performance, cost, and efficiency curves of the semiconductor and computing industries by delivering a 1000x improvement in interconnect bandwidth density at 10x lower power. We use standard CMOS processing to develop high-speed, high-density, low-power optical interconnect “chiplets” and lasers to replace traditional electrical I/O.

Industry Verticals

Artificial Intelligence &
High Performance Computing

Enables new architectures to speed the process of organizing and analyzing complex data sets that will ultimately lead to deeper learning and a wellspring of new findings and ideas. Unparalleled bandwidth, power, and latency that enables glueless interconnect and memory fabrics. Unprecedented reach.

Cloud &
Telecom

Provides exceptional bandwidth, power, and connectivity for TEM (telco equipment manufacturers) to enable 5G at scale. Optical doesn’t interfere with 5G signals. Unprecedented reach for cloud, enables new era of disaggregated design/flexibility.

Military &
Aerospace

Facilitates next generation of real-time digital beamforming solutions by handling data movement from antenna elements through the backend processing compute infrastructure.

Light Detection and Ranging
(LIDAR)

Allows for advanced sensing solutions for autonomous driving and robotic systems.

Miss us at Hot Chips 2019?

President, Chief Scientist, and Co-Founder, Mark Wade presented Ayar Labs’ mission, product strategy, and collaboration with Intel. 

Intel and Ayar Labs demonstrated the industry’s first integration of monolithic in-package optics (MIPO) with a high-performance system-on-chip (SOC) co-packaged with the Intel Stratix 10 FPGA.

The Latest on Ayar Labs

Ayar Labs and Intel Add Optical Input-Output to an FPGA

Intel has teamed with several partners in addition to Ayar Labs for its FPGA-based silicon-in-package design, part of the US Defense Advanced Research Projects Agency’s (DARPA) project.  Ayar Labs used the Hot Chips conference, held in Palo Alto, California in August,...

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Ayar Labs Realizes In-Package Optics

The holy grail of monolithic silicon photonics remains over the horizon, but photonic chiplets will enable leading-edge digital SoCs with in-package optics. In a segment littered with failed startups, Ayar Labs hopes to commercialize in-package optics using silicon...

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At Hot Chips, Intel Pushes ‘AI Everywhere’

What’s New: At Hot Chips 2019, Intel revealed new details of upcoming high-performance artificial intelligence (AI) accelerators: Intel® Nervana™ neural network processors, with the NNP-T for training and the NNP-I for inference. Intel engineers also presented...

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