Ayar Labs Partners with Department of Defense to Accelerate Transition to Optical I/O in Next-Gen Defense Applications
Revolutionizing Chip-to-Chip Communication
Ayar Labs is disrupting the traditional performance, cost, and efficiency curves of the semiconductor and computing industries by delivering up to a 1000x improvement in interconnect bandwidth density at one-tenth the power. We use standard CMOS processing to develop high-speed, high-density, low-power optical interconnect “chiplets” and lasers to replace traditional electrical I/O.
Cloud
→ Disaggregated architectures
→ Glue-less interconnects
→ Memory semantic fabrics
AI/HPC
→ Chip-chip low latency
→ Bandwidth
→ HBM capacity
Connectivity
→ Disaggregated base stations
→ RF-optical I/O
→ Digital beam forming
Intelligent Edge
→ RF sensing
→ Phased array radar
→ AI at the edge
On Demand Webinar:
Meeting the Bandwidth Demands of Next-Gen HPC & AI System Architectures
In this panel discussion, leading experts explore innovative system designs and solutions for AI/HPC to address these challenges and unlock greater value from research, science, and business initiatives. Join this webinar to explore what these pioneers are learning as they define and develop new architectures and drive computing to the next level of performance.
Have You Seen the
LIGHT?
Chip-to-chip communication is advancing at the speed of light. Are you keeping up?
Major players from all over the technology map—AI, HPC, aerospace, data center, cloud, and telecom—are developing optical I/O (OIO) next-generation solutions to meet the growing bandwidth, power, and latency requirements of the most demanding applications. Discover how HPE, Intel, Lockheed, NVIDIA, Raytheon, and others are looking to in-package optical I/O to ramp up data movement, build composable architectures, and get that next million-X speed-up in AI.
Ayar Labs: Solving Data Bottlenecks with Optical I/O
Ayar Labs is solving the critical performance bottlenecks in computing systems with optical I/O. By moving data between computer chips using light instead of electricity, systems achieve a dramatic leap in performance and latency with much lower power.
In-Package Optical I/O: Unleashing Innovation
Discover how Ayar Labs’ optical I/O solution is the key to unleashing innovation in AI, scaling cloud and HPC, launching new aerospace systems, enabling the next wave of 5G, and more.
Advancing Aerospace Applications with Optical I/O
Optical I/O: Designing the Future of Digital Beamforming and Antenna Arrays
Digital beamforming, which uses a large number of elements in antenna arrays, is the core technology driving advanced radar and communications systems for the aerospace industry. Phased array radar demands increasingly higher fidelity, which requires more elements generating more data. Only optical I/O from Ayar Labs provides the bandwidth density needed to deliver precise, higher fidelity phased array radar.
SWaP-Friendly Architectures Using Digital Beamforming and Optical I/O
The power and sophistication of modern radar systems is growing by leaps and bounds. These systems already offer capabilities that couldn’t have been dreamed of just a few short years ago. Furthermore, ongoing developments mean that these systems are poised to revolutionize sensing applications. However, there is a data bandwidth bottleneck that must be overcome to take full advantage of these state-of-the-art technologies.
Disaggregated System Architectures with Optical I/O
In-Package Optical I/O Will Unleash the Full Potential of AI
Ayar Labs’ Optical I/O Enables Disaggregated Architectures for Cloud, AI, and HPC
Recent Announcements
Ayar Labs Partners with Department of Defense to Accelerate Transition to Optical I/O in Next-Gen Defense Applications
Project KANAGAWA granted to Ayar Labs with goal of transitioning optical Input/Output (I/O) into the Defense Industrial Base (DIB) while driving affordability and scalability for production…
In the Media
Computing, chips, foundational tech: The 8 next big things, from smart-home connectivity to AI-assisted chip design
Thanks to innovations in computing and chips, our technology is smarter—and better connected—than ever before. We now have AI to help make processors faster, more capable, and more power-efficient; 3D printing to create metals at far greater speeds than existing tech; and connectivity protocols to create reliable and secure IoT ecosystems.
Latest Resources
Webinar: Meeting the Bandwidth Demands of Next-Gen HPC & AI System Architectures
In artificial intelligence (AI), increasingly complex algorithms, larger datasets, and process-intensive workloads lend to an insatiable demand for compute, memory, and storage, as well as higher-bandwidth, lower-latency communication between these components.
Optical I/O: Designing the Future of Digital Beamforming and Antenna Arrays
Digital beamforming, which uses a large number of elements in antenna arrays, is the core technology driving advanced radar and communications systems for the aerospace industry. Phased array radar demands increasingly higher fidelity, which requires more elements...
Expanding Bandwidth and Flexibility for Telecommunications Using Optical I/O
As 5G networking transforms the telecommunications industry and next-generation 6G is close at
hand, the need for increased bandwidth (BW) across wireless and wired infrastructure components
has become obvious.
Ayar Labs’ Optical I/O Enables Disaggregated Architectures for Cloud, AI, and HPC
Disaggregated architectures are shifting the paradigm of innovation by enabling resource composability for more efficient utilization in Cloud, AI, and high performance computing.