Enabling the next phase of Moore’s Law through optical connectivity
Ayar Labs solves the I/O bandwidth and power bottlenecks by moving data using light.
Announcing a new industry consortium dedicated to defining specifications for multi-wavelength advanced integrated optics.
Learn more about the CW-WDM MSA →
The latest business and product developments at Ayar Labs
Ayar Labs is disrupting the traditional performance, cost, and efficiency curves of the semiconductor and computing industries by delivering a 1000x improvement in interconnect bandwidth density at 10x lower power. We use standard CMOS processing to develop high-speed, high-density, low-power optical interconnect “chiplets” and lasers to replace traditional electrical I/O.
HPC Solution Brief
Paradigm Change: Reinventing HPC Architectures with In-Package Optical I/O
Even with the first exascale systems just around the corner, HPC centers are already wrestling with what technologies will provide the next level of compute performance, bandwidth and memory to continue to advance their science.
Learn how Ayar Labs In-Package Optical I/O technologies are reinventing HPC Architectures that will enable HPC centers to continue to push boundaries for HPC and AI.
Industry Verticals
Optical I/O Takes a Major Step Forward
PIPES Researchers from Ayar Labs and Intel Demonstrate Optical Interconnects to Improve Performance of Digital Microelectronics
See how optical chips can be pushed directly into the CPU/GPU/ASIC package, enabling next-gen computer architectures
Learn how Ayar Labs is breaking optical I/O milestones while adjusting to the ‘new normal’ in our latest blog post
Miss us at Hot Chips 2019?
President, Chief Scientist, and Co-Founder, Mark Wade presented Ayar Labs’ mission, product strategy, and collaboration with Intel.
Intel and Ayar Labs demonstrated the industry’s first integration of monolithic in-package optics (MIPO) with a high-performance system-on-chip (SOC) co-packaged with the Intel Stratix 10 FPGA.
Recent Announcements
CW-WDM MSA Group Forms to Drive New Industry Standard for Optical Laser Sources
Specification sets the stage for advances in artificial intelligence, data center efficiency, and other advanced applications of optical interconnect Santa Clara, California – June 24, 2020 – The CW-WDM MSA (Continuous-Wave Wavelength Division Multiplexing...
In the Media
CMOS Plus On-Chip Electro-Optical Interconnect Zooms Past 2 Tb/s
A highly advanced management of electronics, CMOS, and optical physics is pushing system-in-package designs past the terabit-per-second boundary in this DARPA-sponsored project with Ayar Labs and Intel. What you’ll learn DARPA, Intel, and Ayar Labs collaborate on...
Latest Resources
Demonstration of Ayar Labs’ Optical I/O Multi-Chip Package and Single-Die Package solutions
Our longstanding relationship with DARPA has helped us to achieve a first-of-its-kind demonstration where we have implemented our CMOS-based optical I/O TeraPHY™ chiplets inside the same package as an advanced SOC. More resources from Ayar Labs:
Paradigm Change: Reinventing HPC Architectures with In-Package Optical I/O
Even with the first exascale systems just around the corner, HPC centers are already wrestling with what technologies will provide the next level of compute performance, bandwidth and memory to continue to advance their science. And while some CPU/GPU manufacturers...
Investing in our Vision to Make In-Package Optical I/O a Reality
Discover what Ayar Labs has accomplished in the 2nd quarter of 2020, during these unprecedented times. From opening a new office and the purchase of a new wafer prober to the formation of the CW-WDM MSA and new product demonstration milestones, Ayar Labs has been...
Demonstration of Ayar Labs’ Optical I/O Multi-Chip Package and Single-Die Package solutions
Our longstanding relationship with DARPA has helped us to achieve a first-of-its-kind demonstration where we have implemented our CMOS-based optical I/O TeraPHY™ chiplets inside the same package as an advanced SOC. More resources from Ayar Labs: