Enabling the next phase of Moore’s Law through optical connectivity
Ayar Labs solves the I/O bandwidth and power bottlenecks by moving data using light.
Watch the Video
Disaggregated HPC-AI at Scale: the Emergence of Optical I/O Chiplets
Webinar: Advanced Memory Architectures to Overcome Bandwidth Bottlenecks for the Exascale Era of Computing
Ayar Labs Named a 2021 Gartner ‘Cool Vendor’ in Silicon Photonics
Technical Brief:
Optical I/O Chiplets Eliminate Bottlenecks to Unleash Innovation
This technical brief examines the evolution of optical communications in computing systems and the transition to ‘Phase Two’ of Moore’s Law through in-package optical I/O (OIO).
- Trends Driving In-Package Optical I/O Chiplets
- Electrical I/O Barriers to High-Performance Architectures
- Ayar Labs Optical I/O Chiplet
- Applications of Optical I/O
Industry’s First Terabit Optical Link
Technical Paper
An Error-free 1 Tbps WDM Optical I/O Chiplet and Multi-wavelength Multi-port Laser
In this paper we demonstrate a 128 Gbps/port (8-λ×16 Gbps/λ) natively error-free transmission across eight optical ports using a 8-port, 8-λ/port WDM remote laser source and a pair of monolithically integrated CMOS optical I/O chiplets with 4.96-5.56 pJ/bit optical Tx+Rx chiplet energy efficiency.
Video Demonstration
The CW-WDM MSA Consortium Releases New Specification for Multi-Wavelength Optical Laser Sources
Learn more about the specification →
Revolutionizing Chip-to-Chip Communication Across Industry Verticals
Ayar Labs is disrupting the traditional performance, cost, and efficiency curves of the semiconductor and computing industries by delivering up to a 1000x improvement in interconnect bandwidth density at one-tenth the power. We use standard CMOS processing to develop high-speed, high-density, low-power optical interconnect “chiplets” and lasers to replace traditional electrical I/O.
Cloud
→ Disaggregated Architectures
→ Glue-less interconnects
→ Memory semantic fabrics
AI/HPC
→ Chip-Chip low latency
→ Bandwidth
→ HBM Capacity
Connectivity
→ Disaggregated base stations
→ RF-Optical I/O
→ Digital Beam Forming
Intelligent Edge
→ RF Sensing
→ Phased Array Radar
→ AI at the edge
Optical I/O for Aerospace & Defense
Solution Brief: Unleashing Opportunities in the Aerospace Industry with Optical I/O
The promise of in-package optical I/O for aerospace addresses the demands of maintaining technological leadership in the changing global environment. In this solution brief, we discuss the capabilities of optical I/O for aerospace and its role in the development of new sensing and computer architectures that disaggregate the functional units within a system.
Learn how optical signaling interfaces can contribute to resolving bandwidth, latency, and power challenges across a range of applications.
Six Reasons the Aerospace Sector Needs Optical I/O Solutions
Companies developing the next generation of aerospace and defense solutions are pursuing a myriad of innovative ideas and technologies. From improving surface-to-air and vehicle-to-vehicle communication to enabling autonomous vehicle and unmanned aircraft operations…
Request your Optical I/O Starter Kit Today
Become a part of the I/O revolution and begin evaluating optical I/O for your next generation SoC architectures now with the Ayar Labs Optical I/O Starter Kit. The kit includes everything you need and can be customized to meet your product requirements.
Recent Announcements
Ayar Labs Expands Global Presence and Adds Industry Veterans to Executive Team
Named a Cool Vendor in Silicon Photonics by Gartner SANTA CLARA, CA and LONDON, UK, June 29, 2021 – In order to address the UK and European market demand for in-package Optical I/O, Ayar Labs has established an international subsidiary with Ayar Labs UK Ltd. Optical...
In the Media
Sivers Semiconductors: to develop CW-WDM MSA compliant DFB laser arrays
Sivers Semiconductors AB today announced that its subsidiary, Sivers Photonics, will develop CW-WDM MSA compliant laser arrays that support Ayar Labs' optical I/O solution. Ayar Labs is the leader in integrated optical I/O and is pushing the boundaries for AI, cloud,...
Latest Resources
Webinar: Advanced Memory Architectures to Overcome Bandwidth Bottlenecks for the Exascale Era of Computing
A key barrier to unlocking future system performance is overcoming the bandwidth bottlenecks that limit inter-processor and memory performance. Current solutions, such as HBM and DDR5, are constrained because of thermal and signal integrity issues. New HPC and AI...
Technical Brief: Optical I/O Chiplets Eliminate Bottlenecks to Unleash Innovation
This technical brief examines the evolution of optical communications in computing systems and the transition to ‘Phase Two’ of Moore’s Law through in-package optical I/O (OIO). Trends Driving In-Package Optical I/O Chiplets Electrical I/O Barriers to High-Performance...
Demo of the SuperNova™ Light Source Operating from 15-100°C
Ayar Labs demonstrates the industry’s first continuous wave, CW-WDM MSA compliant, 8 wavelength, 8 port optical source operating from 15 to 100°C on a 400 GHz wavelength grid. Learn more about the SuperNova light source for optical I/O, AI, optical computing and...
Disaggregating System Architectures for Future HPC and AI Workloads
An explosion in demand for more compute capacity for high-performance computing (HPC) and artificial intelligence (AI) workloads is about to usher in a new era of disaggregated system architectures - with an emphasis on increased flexibility, efficiency, speed, and...