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Enabling the next phase of Moore’s Law through optical connectivity

Ayar Labs solves I/O bandwidth and power bottlenecks by moving data using light.

News

Ayar Labs to Accelerate Development and Application of Optical Interconnects in AI/ML Architectures with NVIDIA

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Hewlett Packard Enterprise and Ayar Labs Announce Strategic Collaboration and Investment

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Ayar Labs Raises $130 Million in Series C Funding, Accelerating Commercialization of Industry’s First In-Package Optical I/O Products

Revolutionizing Chip-to-Chip Communication

Ayar Labs is disrupting the traditional performance, cost, and efficiency curves of the semiconductor and computing industries by delivering up to a 1000x improvement in interconnect bandwidth density at one-tenth the power. We use standard CMOS processing to develop high-speed, high-density, low-power optical interconnect “chiplets” and lasers to replace traditional electrical I/O.

Cloud

→ Disaggregated architectures

→ Glue-less interconnects

→ Memory semantic fabrics

AI/HPC

→ Chip-chip low latency

→ Bandwidth

→ HBM capacity

Connectivity

→ Disaggregated base stations

→ RF-optical I/O

→ Digital beam forming

Intelligent Edge

→ RF sensing

→ Phased array radar

→ AI at the edge

Have You Seen the

LIGHT?

Chip-to-chip communication is advancing at the speed of light. Are you keeping up?

Major players from all over the technology map—AI, HPC, aerospace, data center, cloud, and telecom—are developing optical I/O (OIO) next-generation solutions to meet the growing bandwidth, power, and latency requirements of the most demanding applications. Discover how HPE, Intel, Lockheed, NVIDIA, Raytheon, and others are looking to in-package optical I/O to ramp up data movement, build composable architectures, and get that next million-X speed-up in AI.

Ayar Labs: Solving Data Bottlenecks with Optical I/O

Ayar Labs is solving the critical performance bottlenecks in computing systems with optical I/O. By moving data between computer chips using light instead of electricity, systems achieve a dramatic leap in performance and latency with much lower power.

In-Package Optical I/O: Unleashing Innovation

Discover how Ayar Labs’ optical I/O solution is the key to unleashing innovation in AI, scaling cloud and HPC, launching new aerospace systems, enabling the next wave of 5G, and more.

Boosting Telecom Bandwidth with Optical I/O

Five Key Factors Driving the Need for Optical I/O in Telecommunications

As 5G and mmWave technologies open up new avenues of bandwidth, the industry faces challenges that stem from outdated legacy technology holding back progress in delivering connectivity. The practical truth is that copper-based interconnects and cabling are approaching their limits for the telecommunications industry — especially in the post-5G age.

Expanding Bandwidth and Flexibility for Telecommunications Using Optical I/O

5G brings an entirely new way of delivering connectivity, with beamforming technology that enables separate, narrow beams directed to individual devices. This requires much more complex systems with compact, lightweight, low-power antenna arrays.

Disaggregated System Architectures with Optical I/O

In-Package Optical I/O Will Unleash the Full Potential of AI

Today’s enterprise-level artificial intelligence (AI) models are growing in both size and sophistication at an unprecedented rate. Unfortunately, the traditional architectures found in data centers cannot satisfy the evolving demands of these AI systems. An emerging solution is to employ the composability capabilities provided by disaggregated system architectures. However, the full potential of disaggregated architectures can be achieved only by means of advanced in-package optical input/output (I/O) technology.

Ayar Labs’ Optical I/O Enables Disaggregated Architectures for Cloud, AI, and HPC

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