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Enabling the next phase of Moore’s Law through optical connectivity

Ayar Labs solves I/O bandwidth and power bottlenecks by moving data using light.

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Ayar Labs Partners with Department of Defense to Accelerate Transition to Optical I/O in Next-Gen Defense Applications

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Lockheed Martin, Ayar Labs Partner to Advance Microchip Connectivity for Next Generation Sensory Systems

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Ayar Labs to Accelerate Development and Application of Optical Interconnects in AI/ML Architectures with NVIDIA

Revolutionizing Chip-to-Chip Communication

Ayar Labs is disrupting the traditional performance, cost, and efficiency curves of the semiconductor and computing industries by delivering up to a 1000x improvement in interconnect bandwidth density at one-tenth the power. We use standard CMOS processing to develop high-speed, high-density, low-power optical interconnect “chiplets” and lasers to replace traditional electrical I/O.

Cloud

→ Disaggregated architectures

→ Glue-less interconnects

→ Memory semantic fabrics

AI/HPC

→ Chip-chip low latency

→ Bandwidth

→ HBM capacity

Connectivity

→ Disaggregated base stations

→ RF-optical I/O

→ Digital beam forming

Intelligent Edge

→ RF sensing

→ Phased array radar

→ AI at the edge

Ayar Labs Demonstrates the Industry’s First 4 Tbps Optical Solution for Chip-to-Chip Connectivity

At OFC 2023, Ayar Labs showcased its CW-WDM optical I/O solution moving data from one TeraPHY™ optical I/O chiplet to another TeraPHY chiplet at 2.048 Tbps, powered by SuperNova™ light sources. Each SuperNova light source powers 8 optical ports in each TeraPHY I/O chiplet. With 8 precisely spaced wavelengths modulated at a data rate of 32 Gbps, each optical port delivers 256 Gbps of bandwidth. Each TeraPHY chiplet therefore provides a throughput of 2.048 Tbps in each direction, or 4.096 Tbps bidirectional.

Fabricated in the GF Fotonix process, the electro-optical transceivers in the TeraPHY chiplet are fully integrated and achieve error-free data transmission without FEC (forward error correction). Perhaps more importantly, the data transfer consumes less than 5 pJ/bit, providing the power density and performance per watt needed to achieve trillions of AI connections in advanced HPC designs and more.

Have You Seen the

LIGHT?

Chip-to-chip communication is advancing at the speed of light. Are you keeping up?

Major players from all over the technology map—AI, HPC, aerospace, data center, cloud, and telecom—are developing optical I/O (OIO) next-generation solutions to meet the growing bandwidth, power, and latency requirements of the most demanding applications. Discover how HPE, Intel, Lockheed, NVIDIA, Raytheon, and others are looking to in-package optical I/O to ramp up data movement, build composable architectures, and get that next million-X speed-up in AI.

Ayar Labs: Solving Data Bottlenecks with Optical I/O

Ayar Labs is solving the critical performance bottlenecks in computing systems with optical I/O. By moving data between computer chips using light instead of electricity, systems achieve a dramatic leap in performance and latency with much lower power.

In-Package Optical I/O: Unleashing Innovation

Discover how Ayar Labs’ optical I/O solution is the key to unleashing innovation in AI, scaling cloud and HPC, launching new aerospace systems, enabling the next wave of 5G, and more.

Advancing Aerospace Applications with Optical I/O

Optical I/O: Designing the Future of Digital Beamforming and Antenna Arrays

Digital beamforming, which uses a large number of elements in antenna arrays, is the core technology driving advanced radar and communications systems for the aerospace industry. Phased array radar demands increasingly higher fidelity, which requires more elements generating more data. Only optical I/O from Ayar Labs provides the bandwidth density needed to deliver precise, higher fidelity phased array radar.

SWaP-Friendly Architectures Using Digital Beamforming and Optical I/O

The power and sophistication of modern radar systems is growing by leaps and bounds. These systems already offer capabilities that couldn’t have been dreamed of just a few short years ago. Furthermore, ongoing developments mean that these systems are poised to revolutionize sensing applications. However, there is a data bandwidth bottleneck that must be overcome to take full advantage of these state-of-the-art technologies.

Disaggregated System Architectures with Optical I/O

Hewlett Packard Enterprise and Ayar Labs Announce Strategic Collaboration and Investment to Develop Next-Generation Data Center Architectures and Networking with Optical I/O

Hewlett Packard Enterprise and Ayar Labs, the leader in chip-to-chip optical connectivity, today announced a multi-year strategic collaboration to usher in a new era of data center innovation by developing silicon photonics solutions based on optical I/O technology. The development of these technologies will support future requirements for high performance computing (HPC) and artificial intelligence (AI) solutions.

Ayar Labs’ Optical I/O Enables Disaggregated Architectures for Cloud, AI, and HPC

Recent Announcements

In the Media

OFC 2023: new launches round-up, part II

The 2023 Optical Fiber Communications Conference and Exhibition (OFC) exhibition, taking place this week in San Diego, Ca., features demonstrations of the industry’s most innovative new products and optical technologies driving advances in quantum networking, AI, and data center connectivity…

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