Enabling the next phase of Moore’s Law through optical connectivity

Ayar Labs solves the I/O bandwidth and power bottlenecks by moving data using light.

The 10 Hottest Semiconductor Startups Of 2020


Dramatically improving I/O performance at lower power

Enabling new system architectures and topologies

Improving resiliency and reach

Request your Optical I/O Starter Kit Today

Become a part of the I/O revolution and begin evaluating optical I/O for your next generation SoC architectures now with the Ayar Labs Optical I/O Starter Kit.  The kit includes everything you need and can be customized to meet your product requirements.

The Latest Business and Product Developments at Ayar Labs

Ayar Labs is disrupting the traditional performance, cost, and efficiency curves of the semiconductor and computing industries by delivering a 1000x improvement in interconnect bandwidth density at 10x lower power. We use standard CMOS processing to develop high-speed, high-density, low-power optical interconnect “chiplets” and lasers to replace traditional electrical I/O.

Optical I/O for HPC & AI

Solution Brief:

Unlocking the True Potential of AI with In-Package Optical I/O

In just a couple of short years in artificial intelligence (AI), optical interconnects have gone from being barely discussed to becoming a critical feature in the future architectures of leading vendors. In fact, based on current trends, it’s arguable that without optical I/O, AI and machine learning (ML) will never reach their full potential. That begs the question, what’s driving this pivot toward optical interconnects and what optical technology breakthroughs are critical to maximizing progress?


Disaggregated Architectures for Next Generation HPC and AI Workloads

This webinar brings together thought leaders working across government, industry and academia who are building and exploring disaggregated architectures and the technologies that enable them. Explore the promise and challenges of building HPC architectures of the future!

Solution Brief:

Paradigm Change: Reinventing HPC Architectures with In-Package Optical I/O

Even with the first exascale systems just around the corner, HPC centers are already wrestling with what technologies will provide the next level of compute performance, bandwidth and memory to continue to advance their science.

Learn how Ayar Labs In-Package Optical I/O technologies are reinventing HPC Architectures that will enable HPC centers to continue to push boundaries for HPC and AI.


Announcing a new industry consortium dedicated to defining specifications for multi-wavelength advanced integrated optics.

Learn more about the CW-WDM MSA →

Optical I/O Takes a Major Step Forward

PIPES Researchers from Ayar Labs and Intel Demonstrate Optical Interconnects to Improve Performance of Digital Microelectronics

See how optical chips can be pushed directly into the CPU/GPU/ASIC package, enabling next-gen computer architectures

Learn how Ayar Labs is breaking optical I/O milestones while adjusting to the ‘new normal’ in our latest blog post

Miss us at Hot Chips 2019?

President, Chief Scientist, and Co-Founder, Mark Wade presented Ayar Labs’ mission, product strategy, and collaboration with Intel. 

Intel and Ayar Labs demonstrated the industry’s first integration of monolithic in-package optics (MIPO) with a high-performance system-on-chip (SOC) co-packaged with the Intel Stratix 10 FPGA.

Recent Announcements

In the Media

Ayar Labs’ TeraPhy Chiplet Nears Volume Production

Moving data between processing nodes - whether servers in a data centre or specialised computing nodes used for supercomputing and artificial intelligence (AI) - is becoming a performance bottleneck. Workloads continue to grow yet networking isn’t keeping pace with...

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Latest Resources

Silicon Photonics and Heterogeneous Integration Challenges

In this recorded presentation, Roy Meade, VP of Manufacturing at Ayar Labs, shares how materials engineering can impact the cost and performance of silicon photonics products, with specifics on in-package photonics. Roy details the four development areas of in-package...

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