Enabling the next phase of Moore’s Law through optical connectivity

Ayar Labs solves the I/O bandwidth and power bottlenecks by moving data using light.

Dramatically improving I/O performance at lower power

Enabling new system architectures and topologies

Improving resiliency and reach

Ayar Labs is disrupting the traditional performance, cost, and efficiency curves of the semiconductor and computing industries by delivering a 1000x improvement in interconnect bandwidth density at 10x lower power. We use standard CMOS processing to develop high-speed, high-density, low-power optical interconnect “chiplets” and lasers to replace traditional electrical I/O.

Miss us at Hot Chips 2019?

President, Chief Scientist, and Co-Founder, Mark Wade presented Ayar Labs’ mission, product strategy, and collaboration with Intel. 

Intel and Ayar Labs demonstrated the industry’s first integration of monolithic in-package optics (MIPO) with a high-performance system-on-chip (SOC) co-packaged with the Intel Stratix 10 FPGA.

The Latest on Ayar Labs

On-Chip Optical Links Are One Step Closer To Reality

Ayar Labs looks like it is just about ready to put its optical I/O chiplet technology into commercial datacenter products.  A presentation at the recent Hot Chips conference revealed a lot more detail about Ayar’s technology than it has have offered in the past, while...

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Ayar Labs and Intel add optical input-output to an FPGA

Intel has teamed with several partners in addition to Ayar Labs for its FPGA-based silicon-in-package design, part of the US Defense Advanced Research Projects Agency’s (DARPA) project.  Ayar Labs used the Hot Chips conference, held in Palo Alto, California in August,...

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Ayar Labs Realizes In-Package Optics

The holy grail of monolithic silicon photonics remains over the horizon, but photonic chiplets will enable leading-edge digital SoCs with in-package optics. In a segment littered with failed startups, Ayar Labs hopes to commercialize in-package optics using silicon...

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