Ayar Labs Blog
Ayar Labs and GUC Complete Successful Thermal Co-Simulation Testing of Co-Packaged Optics
The CPO revolution is at our doorstep. But transforming data center interconnects requires overcoming new challenges in architecture, power delivery, mechanical design, and thermal management. Of these, thermal management has emerged as one of the most critical areas for successfully deploying co-packaged optics (CPO) in hyperscale AI environments.
Building a Production-Ready Optically Connected Rack for AI Scale-Up
Co-packaged optics is emerging as the only solution capable of delivering the bandwidth density and efficiency that multi-rack scale-up demands.
What Will It Take to Deploy CPO at Scale? Experts from Alchip, Astera Labs, and Ayar Labs Weigh In
Co-packaged optics is at an inflection point. We see it rapidly transitioning from proof-of-concept prototypes to manufacturable systems.
Building the Future of AI Infrastructure: The Power of a Robust ASIC Ecosystem
At Ayar Labs, we believe that the future of AI infrastructure will be shaped not by any single company, but by a robust ecosystem of partners working together to push the boundaries of what’s possible.
Let’s Get Serious: TeraPHY™ Optical Engine Passes the Test for AI Scale-Up at Volume
The TeraPHY optical engine is the industry’s first Universal Chiplet Interconnect Express (UCIe) optical interconnect chiplet that can deliver 8 Tbps of bandwidth. Built to maximize AI scale-up architecture performance and efficiency, it reduces latency and power consumption while overcoming the bandwidth and reach limitations of traditional copper interconnects.
Co-Packaged Optics (CPO) Step Into the Spotlight
Optical interconnects in the data center took center stage at NVIDIA’s GTC 2025 conference in March when Jensen Huang announced two network switches incorporating co-packaged optics (CPO), which combine photonics and electronics in a single package for higher performance and efficiency.
Breaking Through Bottlenecks: Executives from AMD, Ayar Labs, Cerebras, and Microsoft, Discuss the Future of AI Infrastructure with Optical I/O
The semiconductor industry is buzzing with discussions around the challenges of scaling AI infrastructure. One topic of particular focus is the limitations of copper interconnects and the promising potential of silicon photonics, optical I/O in particular, to meet growing bandwidth demands.