Presentation

Silicon Photonics and Heterogeneous Integration Challenges

In this recorded presentation, Roy Meade, VP of Manufacturing at Ayar Labs, shares how materials engineering can impact the cost and performance of silicon photonics products, with specifics on in-package photonics. Roy details the four development areas of in-package...

TeraPHY: Chiplet Technology for Low-Power, High-Bandwidth In-Package Optical I/O

Aug 20, 2019 | Presentation, Resources, Technical Paper

Abstract: This slide deck was presented by Mark Wade on August 20, 2019. It explores Ayar Labs' innovative TeraPHY,...

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Presentation

Silicon Photonics and Heterogeneous Integration Challenges

TeraPHY: Chiplet Technology for Low-Power, High-Bandwidth In-Package Optical I/O

No Results Found

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