Ayar Labs has successfully demonstrated the first ultra-dense optical interconnect solution on GLOBALFOUNDRIES’ next...

Ayar Labs has successfully demonstrated the first ultra-dense optical interconnect solution on GLOBALFOUNDRIES’ next...
As scientific applications and workflows incorporate AI models, new opportunities for innovation in system...
Our longstanding relationship with DARPA has helped us to achieve a first-of-its-kind demonstration where we have...
Even with the first exascale systems just around the corner, HPC centers are already wrestling with what technologies...
Discover what Ayar Labs has accomplished in the 2nd quarter of 2020, during these unprecedented times. From opening a...
Abstract: We demonstrate an electro-optic platform enabling a direct optical I/O interface in an ASIC package. The...
Discover how our optical I/O solution will solve the critical computing challenges of efficiency, density, and distance for next-gen system architectures.
This technical brief examines the evolution of optical communications in computing systems and the transition to...
More resources from Ayar Labs:
Abstract: This slide deck was presented by Mark Wade on August 20, 2019. (48 slides) Authors: Ayar Labs - Dr. Mark...
In this work, we provide an overview of System-in-Package (SiP) integration of an electronic-photonic chiplet fabricated in a commercial CMOS foundry. Assembly considerations, including co-packaging in a standard multi-chip module (MCM) package with a System-on-Chip (SoC), thermals, and fiber attach will be reviewed.
In this review paper, we take a comprehensive view of the performance of the silicon-photonic technologies developed to date for photonic interconnect applications. We also present the latest performance and results of our “zero-change” silicon photonics platforms in 45 nm and 32 nm SOI CMOS.