Disaggregated architectures are shifting the paradigm of innovation by enabling resource composability for more efficient utilization in Cloud, AI, and high performance computing.
Resources
HPE and Ayar Labs: Ushering in a New Era of Innovation with Silicon Photonics
Justin Hotard, EVP and General Manager of HPC and AI at Hewlett Packard Enterprise, and Charles...
Optical Interconnects for Future Advanced Antenna Systems: Architectures, Requirements and Technologies
This technical paper aims to give an outlook of future advanced antenna systems for 5G and 6G wireless networks. The trend to increase the peak data rate and to reduce latency and power consumption will continue in the future.
SuperNova™: The Industry’s First Multi-wavelength, Multi-port Optical Source with 64 Wavelengths
Ayar Labs demonstrates the industry’s first multi-wavelength, multi-port optical source with 64 addressable...
An Error-free 1 Tbps WDM Optical I/O Chiplet and Multi-wavelength Multi-port Laser
We demonstrate 128 Gbps/port (8-λ×16 Gbps/λ) natively error-free transmission across eight optical ports using a...
In-Package Optical I/O: Unleashing Innovation
Ayar Labs has developed the first monolithic, in-package optical I/O chiplet that eliminates the bottlenecks in...
Unleashing Opportunities with Optical I/O for the Aerospace Industry
Tasked with maintaining a competitive footing worldwide, aerospace and defense organizations are increasingly...
Silicon Photonics and Heterogeneous Integration Challenges
In this recorded presentation, Roy Meade, VP of Manufacturing at Ayar Labs, shares how materials engineering can...
Unlocking the True Potential of AI with In-Package Optical I/O
In just a couple of short years in artificial intelligence (AI), optical interconnects have gone from being barely...
In-Package Optical I/O: On the Cusp of High Volume Manufacturing
Ayar Labs has successfully demonstrated the first ultra-dense optical interconnect solution on GLOBALFOUNDRIES’ next...
Webinar: Disaggregated System Architectures for Next Generation HPC and AI Workloads
As scientific applications and workflows incorporate AI models, new opportunities for innovation in system...
Demonstration of Ayar Labs’ Optical I/O Multi-Chip Package and Single-Die Package Solutions
Our longstanding relationship with DARPA has helped us to achieve a first-of-its-kind demonstration where we have...