This technical paper aims to give an outlook of future advanced antenna systems for 5G and 6G wireless networks. The trend to increase the peak data rate and to reduce latency and power consumption will continue in the future.
Resources
Webinar: Advanced Memory Architectures to Overcome Bandwidth Bottlenecks for the Exascale Era of Computing
A key barrier to unlocking future system performance is overcoming the bandwidth bottlenecks that limit...
Technical Brief: Optical I/O Chiplets Eliminate Bottlenecks to Unleash Innovation
This technical brief examines the evolution of optical communications in computing systems and the transition to...
Demonstration of Ayar Labs’ Optical I/O Multi-Chip Package and Single-Die Package Solutions
Our longstanding relationship with DARPA has helped us to achieve a first-of-its-kind demonstration where we have...
Paradigm Change: Reinventing HPC Architecture with In-Package Optical I/O
Even with the first exascale systems just around the corner, high performance computing (HPC) centers are already...
Investing in Our Vision to Make In-Package Optical I/O a Reality
Discover what Ayar Labs has accomplished in the 2nd quarter of 2020 during these unprecedented times. From opening a...
TeraPHY: An O-band WDM Electro-Optic System for Low Power, Terabit/s Optical I/O
Abstract: We demonstrate an electro-optic system enabling a direct optical I/O interface in an ASIC package. The...
Ayar Labs: Solving Critical Computing Challenges Through Optical I/O
Discover how our optical I/O solution will solve the critical computing challenges of efficiency, density, and distance for next-gen system architectures.
Ayar Labs TeraPHY™ MIPO I/O Chiplet: Enhancing State-of-the-Art, Advanced Architectures
More resources from Ayar Labs:
TeraPHY: Chiplet Technology for Low-Power, High-Bandwidth In-Package Optical I/O
Abstract: This slide deck was presented by Mark Wade on August 20, 2019. It explores Ayar Labs' innovative TeraPHY,...
TeraPHY: A High-Density Electronic-Photonic Chiplet for Optical I/O from a Multi-Chip Module
In this work, we provide an overview of System-in-Package (SiP) integration of an electronic-photonic chiplet fabricated in a commercial CMOS foundry. Assembly considerations, including co-packaging in a standard multi-chip module (MCM) package with a System-on-Chip (SoC), thermals, and fiber attach will be reviewed.
Monolithic Silicon-Photonics Platforms in State-of-the-Art CMOS SOI Processes
In this review paper, we take a comprehensive view of the performance of the silicon-photonic technologies developed to date for photonic interconnect applications. We also present the latest performance and results of our “zero-change” silicon photonics platforms in 45 nm and 32 nm SOI CMOS.