This technical brief examines the evolution of optical communications in computing systems and the transition to...
Resources
Demo of the SuperNova™ Light Source Operating from 15-100°C
Ayar Labs demonstrates the industry’s first continuous wave, CW-WDM MSA compliant, 8 wavelength, 8 port optical source...
Disaggregating System Architectures for Future HPC and AI Workloads
An explosion in demand for more compute capacity for high-performance computing (HPC) and artificial intelligence (AI)...
Investing in Our Vision to Make In-Package Optical I/O a Reality
Discover what Ayar Labs has accomplished in the 2nd quarter of 2020 during these unprecedented times. From opening a...
TeraPHY: An O-band WDM Electro-Optic System for Low Power, Terabit/s Optical I/O
Abstract: We demonstrate an electro-optic system enabling a direct optical I/O interface in an ASIC package. The...
Ayar Labs: Solving Critical Computing Challenges Through Optical I/O
Discover how our optical I/O solution will solve the critical computing challenges of efficiency, density, and distance for next-gen system architectures.
Ayar Labs TeraPHY™ MIPO I/O Chiplet: Enhancing State-of-the-Art, Advanced Architectures
More resources from Ayar Labs:
TeraPHY: Chiplet Technology for Low-Power, High-Bandwidth In-Package Optical I/O
Abstract: This slide deck was presented by Mark Wade on August 20, 2019. It explores Ayar Labs' innovative TeraPHY,...
TeraPHY: A High-Density Electronic-Photonic Chiplet for Optical I/O from a Multi-Chip Module
In this work, we provide an overview of System-in-Package (SiP) integration of an electronic-photonic chiplet fabricated in a commercial CMOS foundry. Assembly considerations, including co-packaging in a standard multi-chip module (MCM) package with a System-on-Chip (SoC), thermals, and fiber attach will be reviewed.
Monolithic Silicon-Photonics Platforms in State-of-the-Art CMOS SOI Processes
In this review paper, we take a comprehensive view of the performance of the silicon-photonic technologies developed to date for photonic interconnect applications. We also present the latest performance and results of our “zero-change” silicon photonics platforms in 45 nm and 32 nm SOI CMOS.
A 40-Gb/s PAM-4 Transmitter Based on a Ring-Resonator Optical DAC in 45-nm SOI CMOS
The next generations of large-scale data-centers and supercomputers demand optical interconnects to migrate to 400G and beyond. Microring modulators in silicon-photonics VLSI chips are promising devices to meet this demand due to their energy efficiency and compatibility with dense wavelength division multiplexed chip-to-chip optical I/O.
WaveLight: A Monolithic Low Latency Silicon-Photonics Communication Platform for the Next-Generation of Disaggregated Cloud Data Centers
In this work, we present WaveLight, a monolithic silicon-photonics platform whereby a low latency reliable deterministic protocol with optical functions are designed directly into an existing high-volume CMOS process.