This technical paper aims to give an outlook of future advanced antenna systems for 5G and 6G wireless networks. The trend to increase the peak data rate and to reduce latency and power consumption will continue in the future.
Technical Paper
Technical Brief: Optical I/O Chiplets Eliminate Bottlenecks to Unleash Innovation
This technical brief examines the evolution of optical communications in computing systems and the transition to...
An Error-free 1 Tbps WDM Optical I/O Chiplet and Multi-wavelength Multi-port Laser
We demonstrate 128 Gbps/port (8-λ×16 Gbps/λ) natively error-free transmission across eight optical ports using a...
Optical Interconnects for Future Advanced Antenna Systems: Architectures, Requirements and Technologies
This technical paper aims to give an outlook of future advanced antenna systems for 5G and 6G wireless networks. The trend to increase the peak data rate and to reduce latency and power consumption will continue in the future.
Technical Brief: Optical I/O Chiplets Eliminate Bottlenecks to Unleash Innovation
This technical brief examines the evolution of optical communications in computing systems and the transition to...
An Error-free 1 Tbps WDM Optical I/O Chiplet and Multi-wavelength Multi-port Laser
We demonstrate 128 Gbps/port (8-λ×16 Gbps/λ) natively error-free transmission across eight optical ports using a...
TeraPHY: An O-band WDM Electro-Optic System for Low Power, Terabit/s Optical I/O
Abstract: We demonstrate an electro-optic system enabling a direct optical I/O interface in an ASIC package. The...
TeraPHY: Chiplet Technology for Low-Power, High-Bandwidth In-Package Optical I/O
Abstract: This slide deck was presented by Mark Wade on August 20, 2019. It explores Ayar Labs' innovative TeraPHY,...
TeraPHY: A High-Density Electronic-Photonic Chiplet for Optical I/O from a Multi-Chip Module
In this work, we provide an overview of System-in-Package (SiP) integration of an electronic-photonic chiplet fabricated in a commercial CMOS foundry. Assembly considerations, including co-packaging in a standard multi-chip module (MCM) package with a System-on-Chip (SoC), thermals, and fiber attach will be reviewed.
Monolithic Silicon-Photonics Platforms in State-of-the-Art CMOS SOI Processes
In this review paper, we take a comprehensive view of the performance of the silicon-photonic technologies developed to date for photonic interconnect applications. We also present the latest performance and results of our “zero-change” silicon photonics platforms in 45 nm and 32 nm SOI CMOS.
A 40-Gb/s PAM-4 Transmitter Based on a Ring-Resonator Optical DAC in 45-nm SOI CMOS
The next generations of large-scale data-centers and supercomputers demand optical interconnects to migrate to 400G and beyond. Microring modulators in silicon-photonics VLSI chips are promising devices to meet this demand due to their energy efficiency and compatibility with dense wavelength division multiplexed chip-to-chip optical I/O.
WaveLight: A Monolithic Low Latency Silicon-Photonics Communication Platform for the Next-Generation of Disaggregated Cloud Data Centers
In this work, we present WaveLight, a monolithic silicon-photonics platform whereby a low latency reliable deterministic protocol with optical functions are designed directly into an existing high-volume CMOS process.