Demonstration of Ayar Labs’ Optical I/O Multi-Chip Package and Single-Die Package Solutions

Aug 25, 2020 | Resources, Video

Our longstanding relationship with DARPA has helped us to achieve a first-of-its-kind demonstration where we have implemented our CMOS-based optical I/O TeraPHY™ chiplets inside the same package as an advanced SOC. This demonstration represents a groundbreaking advance in multi-chip package and single-die package technology.

Watch the video below to see the fruits of our work with DARPA on optical I/O solutions:

 

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