- Version 1.1
- Download 138
- File Size 364.06 KB
- Create Date March 7, 2019
In this work, we provide an overview of System-in-Package (SiP) integration of an electronic-photonic chiplet fabricated in a commercial CMOS foundry. Assembly considerations, including co-packaging in a standard multi-chip module (MCM) package with a System-on-Chip (SoC), thermals, and fiber attach will be reviewed.
Roy Meade, Shahab Ardalan, Michael Davenport, John Fini, Chen Sun, Mark Wade, Alexandra Wright-Gladstein, and Chong Zhang
Published In: Optical Fiber Communication Conference 2019