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IEEE Hot Interconnects

August 19, 2020 - August 21, 2020

Hot Interconnects

IEEE Hot Interconnects is the premier international forum for researchers and developers of state-of-the-art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core on-chip interconnects to those within systems, clusters, and data centers. Leaders in industry and academia attend the conference to interact with individuals at the forefront of this field.

Be sure to check out our invited talk on Wednesday, August 19, from 2:00 – 2:30 p.m. PST.  Mark Wade, President and CTO, will present:  TeraPHY™: An O-band WDM Electro-optic Chiplet for Low Power, Terabit/s Optical I/O.

In addition, Shahab Ardalan, Principal Engineer in Circuits at Ayar Labs, will present on behalf of the ODSA on Wednesday, August 29, 10:30-11:30 a.m.:  Bunch of Wires: An Open D2D Interface


August 19, 2020
August 21, 2020



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