This global virtual event for Advanced System-in-Package technologies combines the 3D ASIP and IMAPS SiP events into one comprehensive event covering SiP technology developments, solutions, and business trends.

Speakers and panels:

Speaker:  Mark Wade on Thursday, August 12th, 2021, from 8:00 AM to 8:45 AM PST for his keynote presentation: “Optical I/O Chiplets for Next-Generation Heterogeneous Computing.”

Invited Panel Topic: “HPC/chiplet integration and SiP test/yield enhancement.”