Salishan Conference on High-Speed Computing 2023

Salishan Coastal Lodge 7760 North Highway 101, Gleneden Beach, OR, United States

The Salishan Conference on High-Speed Computing was founded in 1981 as a means of getting experts in computer architecture, languages, and algorithms together to improve communications, develop collaborations, solve problems of mutual interest, and provide effective leadership in the field of high-speed computing. Organized by a Tri-Lab committee and hosted by the Association for High-Speed Computing, the conference convenes annually at the Salishan Lodge in Gleneden Beach, Oregon. Attendance at the conference is by invitation only. Attendees are from national laboratories, academia, government, and private industry. To preserve the level of interaction and discussion, in-person conference attendance is kept to about 150. Optical I/O Technology to Meet Future Demands of HPC and AI Presented by invited speaker Mark Wade, CTO, SVP of engineering, and co-founder at Ayar Labs Tuesday, April 25, 2023, 2:30 PM Full Salishan Conference program

CLEO Conference and Exhibition 2023

San Jose McEnery Convention Center 408 Almaden Boulevard, San Jose, United States

With a distinguished history as the industry's leading event on laser science, the Conference on Lasers and Electro-Optics (CLEO) is the premier international forum for scientific and technical optics, uniting the fields of lasers and opto-electronics by bringing together all aspects of laser technology, from basic research to industry applications. Join Ayar Labs for the following special session: AM1R A&T Topical Review on Advanced Micro/Nanoscale Lasers and Modulators Monday, May 8, 2023 9:00-9:30 AM Invited speaker: Mark Wade, CTO, SVP of engineering, and co-founder, Ayar Labs.

ISC High Performance 2023

Congress Center Hamburg Messeplatz 1, 20357, Hamburg, Germany

ISC High Performance 2023 is an international conference and exhibition that fosters the growth of a global HPC (high performance computing) community of technology providers and users. This growing community now includes machine learning, data analytics, and quantum computing practitioners. The first ISC conference was held in 1986. At this annual forum, the HPC community comes together to exchange visions, ideas, and knowledge and dare each other to imagine a better tomorrow. ISC 2023 will be held from May 21 – 25 in Hamburg, Germany, and expects over 3,000 international attendees. ISC 2023 Program  

Disaggregation and Optical Interconnect in AI/HPC Networks


This webinar discusses the push towards disaggregated resources and optical interconnect technologies to enable the next generation of high performance computing (HPC) and artificial intelligence infrastructure. Partners throughout the ecosystem will provide their perspective on the latest advances, from foundry to optical interconnects, to systems and cloud services. In addition, a test and measurement perspective will be provided to support this new wave of interconnect technology. Register Now


Moscone Center 747 Howard St, San Francisco, CA, United States

For 60 years, DAC has been the premier destination for the entire ecosystem devoted to the design and design automation of electronic circuits and systems. DAC offers the electronic design ecosystem outstanding education, training, exhibits and networking opportunities for a worldwide community of chip & system designers, researchers, academics, executives, and electronic design tool vendors to engage and reconnect. Ayar Labs at DAC 2023 Enabling AI at Zettascale: Wafers, Chiplets, or Both? Wednesday, July 12, 2:30 - 3:15 PM PDT Transformative Technologies Theater One of the most critical debates in the hardware and machine learning industries is the chiplet vs. wafer scale approach. The panel will explore the benefits and drawbacks of each approach and discuss their implications for the future of machine learning and chiplet ecosystems. Wafer scale has shown promise in solving memory bandwidth limitations, but there are questions about whether it is the best approach to scaling machine learning networks. On the other hand, the concept of an open chiplet marketplace and ecosystem is heading into strong winds, unsure of its position or productization, let alone the use case. The demand for customized and dedicated machine learning hardware cannot be understated. Without planning today, the scale of […]


Moscone Center 747 Howard St, San Francisco, CA, United States

At SEMICON West, industry professionals will be converging and, together, “Building a Path Forward.” The event focuses on key challenges affecting the global microelectronics industry which include supply chain disruptions, climate change, and talent shortages, all necessary to enable a $1T industry. SEMICON West provides a pathway for attendees to engage, learn, and conduct business under three key industry priorities that will be integrated into our keynotes as a daily theme: Path to $1T Path to net zero Path for talent Ayar Labs at SEMICON West 2023 Heterogeneous Integration: HPC and Hyperscale Computing Panel Discussion and Q&A from the Audience: Wednesday, July 12, 2023 3:20 – 4:40 PM PDT TechTalk Stage, Moscone South, Exhibition Level, Room 4 Heterogeneous Integration through advanced packaging innovations is widely acknowledged as being increasingly important to drive performance, system availability, power efficiency, cost and time to market of microelectronics systems, from HPC & Data Centers, to 5G & Beyond, mobile, automotive, IoT, medical and health markets. As the full microelectronics design and manufacturing supply chain come together to respond to challenges and develop new solutions, two integration technologies, in particular, are paving the way to make these innovations possible – System in Package (SiP) and Chiplets […]

ERI 2.0

Hyatt Regency Seattle 808 Howell Street, Seattle, WA, United States

Experience the insightful discussions as distinguished representatives from our government agencies, the defense industrial base, and esteemed academic institutions come together to share their one-of-a-kind and invaluable viewpoints on the critical role of our domestic semiconductor industry in shaping our national and economic security, as well as outlining the potential avenues for future research and innovation in the field. What is ERI? The Electronics Resurgence Initiative (ERI), DARPA’s response to national-level microelectronics concerns, is designed to ensure U.S. leadership in cross-functional, next-generation microelectronics research, development, and manufacturing. The initiative, aimed at both national security capabilities and commercial economic competitiveness and sustainability, is a thematic portfolio of research programs primarily in the Microsystems Technology Office (MTO). These programs emphasize forward-looking partnerships with U.S. industry, the defense industrial base, and university researchers. ERI Summit 2023 Agenda Ayar Labs at ERI Summit 2023 Join Intel Corporation and Ayar Labs at the PIPES demo table at the ERI Summit to see the first public demonstration of a 4 Tbps optical FPGA. We’ll also have a number of product samples available for an up-close look at our technology. The optical FPGA demonstration shows: Two Intel FPGAs, each integrating two Ayar Labs TeraPHY™ optical I/O chiplets […]

Hot Interconnects 2023


IEEE Hot Interconnects is the premier international forum for researchers and developers of state-of-the-art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core on-chip interconnects to those within systems clusters, and data centers. Leaders in industry and academia attend the conference to interact with individuals at the forefront of this field.

Hot Chips 2023

Stanford University 450 Serra Mall, Stanford, CA, United States

Since it started in 1989, HOT CHIPS has been known as one of the semiconductor industry’s leading conferences on high-performance microprocessors and related integrated circuits. The conference is held once a year in August in the center of the world’s capital of electronics activity, Silicon Valley. The HOT CHIPS conference typically attracts more than 500 attendees from all over the world. It provides an opportunity for chip designers, computer architects, system engineers, press and analysts, as well as attendees from national laboratories and academia to mix, mingle and see presentations on the latest technologies and products. The three days of the conference typically feature two tutorials, two keynotes, a panel discussion and around 25 presentations on a variety of subjects related to microprocessors and integrated circuits. It is widely covered by the media; last year, we had about 25 members of the industry and national press covering the conference. The conference emphasis this year, as in previous years, is on real products and realizable technology. Submissions are invited from a variety of “hot” topics, including embedded and reconfigurable processors, quantum computing, nano structures, wireless chips, network/security processors, advanced packaging technology etc. For a complete list of topics, refer to the […]

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