Glossary
Chiplet — a modular building block of a larger integrated circuit or chip.
CMOS processing — a fabrication process used for chips, analog circuits, and transceivers.
Co-packaged optics (CPO) — optical components that are integrated into a single package.
CW-WDM MSA — an industry consortium that establishes specifications for multi-wavelength advanced integrated optics.
DARPA — Defense Advanced Research Projects Agency.
Disaggregated architecture — a computing approach that spreads functional blocks throughout a system for greater flexibility.
Electro-optical sensor — a detector that can convert light into an electronic signal.
Electro-optical transceiver — converts electronic data into an optical signal and vice versa.