Glossary

Multi-chip package (MCP) (or MCM — multi-chip module) — an assembly of multiple integrated circuits (chips) to create a larger integrated circuit or chip.

AI systems that process and integrate diverse inputs, such as data from text, images, audio, and video.

Optical interconnects — a way of sending signals from one part of an integrated circuit to another using light.

Parameters — internal variables within an AI model that are adjusted during training to improve performance and capture patterns from input data.

Photonic integrated circuit (PIC) — an electronic circuit that uses optical components, such as waveguides, modulators, and lasers, all on a single chip.

Pipeline Parallelism — A technique in AI that divides a model into stages, each executed on a different device, to improve efficiency.

PIPES — a DARPA program for creating in-package photonics solutions.

Pluggable optics — transceiver modules that connect network components to convert high-speed electrical signals into optical signals and vice versa.