HOT CHIPS 2023
August 27 – 29, 2023, Stanford, CA
Join Ayar Labs at HOT CHIPS: one of the semiconductor industry’s leading conferences on high-performance microprocessors and related integrated circuits.
Since it started in 1989, HOT CHIPS has been known as one of the semiconductor industry’s leading conferences on high-performance microprocessors and related integrated circuits. The conference is held once a year in August in the center of the world’s capital of electronics activity, Silicon Valley.
The HOT CHIPS conference typically attracts more than 500 attendees from all over the world. It provides an opportunity for chip designers, computer architects, system engineers, press and analysts, as well as attendees from national laboratories and academia to mix, mingle and see presentations on the latest technologies and products. The three days of the conference typically feature two tutorials, two keynotes, a panel discussion and around 25 presentations on a variety of subjects related to microprocessors and integrated circuits. It is widely covered by the media; last year, we had about 25 members of the industry and national press covering the conference.
The conference emphasis this year, as in previous years, is on real products and realizable technology. Submissions are invited from a variety of “hot” topics, including embedded and reconfigurable processors, quantum computing, nano structures, wireless chips, network/security processors, advanced packaging technology, etc. For a complete list of topics, refer to the official call for papers.
Ayar Labs at HOT CHIPS 2023
Ayar Labs is a HOT CHIPS Silver Sponsor
Intel and Ayar Labs 4 Tbps Optical FPGA Demo
At HOT CHIPS 2023 Intel will showcase a 4 Tbps optical FPGA with Ayar Labs’ in-package optical I/O. You’ll see 4 Tbps bidirectional communication between two optically enabled Intel FPGAs using Ayar Labs TeraPHY™ optical I/O chiplets. Data generated from each FPGA is optically transmitted from one board and received and verified on the other board.
Ayar Labs Demonstrates the Industry’s First 4 Tbps Optical Solution for Chip-to-Chip Connectivity
Ayar Labs will showcase its optical I/O solution moving data from one TeraPHY optical I/O chiplet to another TeraPHY chiplet at 2.048 Tbps, 4.096 Tbps bidirectional, powered by the SuperNova™ light source.
Poster Presentation:
Driving Compute Scale-Out Performance with Optical I/O Chiplets in Advanced System-in-Package Platforms
Authors: Mark Wade, Chen Sun, Matt Sysak, Vladimir Stojanović (Ayar Labs);
Pooya Tadayon, Ravi Mahajan, Babak Sabi (Intel Foundry Services)
Abstract: We present the convergence of multiple technologies that are key to expanding system-level performance in scale-out system architectures: advanced chiplet packaging and optical test capabilities, multi-Tbps optical I/O chiplets with detachable optical connectors, multi-wavelength laser sources, and die-to-die interface standards (UCIe and CW-WDM). Current hardware achieves >2x off-socket bandwidth compared to state-of-the-art GPUs. We highlight the scalable manufacturing ecosystem coalescing to support high-volume production ramps enabling 10-100 Tbps off-package bandwidths with current and next-generation hardware, and we project a path forward to >100 Tbps off-socket bandwidth.
Lightning Talk
Ayar Labs CTO Mark Wade will present the poster during the poster lighting talks.
Tuesday, August 29, 2023
8:30–9:00AM
Blog:
An Important Milestone in Delivering on the Promise of Optical I/O
Ayar Labs and Intel Showcase the Integration of In-Package Optical I/O with an FPGA at 4 Tbps
At Ayar Labs, we are excited to showcase a meaningful milestone in the maturity and manufacturability of our optical I/O solution. Teaming up with Intel, we have unveiled a groundbreaking integration of our optical I/O technology in a common datacenter form factor, providing a look into the future of computing.