In-Package Optical I/O: On the Cusp of High Volume Manufacturing

Dec 7, 2020 | Resources, Video

Ayar Labs has successfully demonstrated the first ultra-dense optical interconnect solution on GLOBALFOUNDRIES’ next generation silicon photonics manufacturing process. With this demonstration, we’re showing that in-package optical I/O is ready to be manufactured in high volume, can be used by existing high performance SOCs, and is well-positioned to intercept future SOC products.  Explore more about this industry-first demo and the partnership that has made it a reality.

 

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