Yole: Leveraging optical chip-to-chip connectivity to unleash the complete potential of AI – An interview with Ayar Labs
Co-packaged optics (CPO) has gained attention recently due to its power efficiency in data centers. While most leading proponents of CPO targeting networking applications have discontinued CPO programs due to macroeconomic headwinds, the situation of CPO for artificial Intelligence (AI) and machine learning (ML) systems is different. AI models have an insatiable demand for computing power, storage, and data movement, and traditional architectures are becoming the main bottleneck for scaling ML.
