Ayar Labs Press Releases

Ayar Labs Demonstrates Industry’s First 4-Tbps Optical Solution, Paving Way for Next-Generation AI and Data Center Designs
Ayar Labs, a leader in the use of silicon photonics for chip-to-chip optical connectivity, today announced public demonstration of the industry’s first 4 terabit-per-second (Tbps) bidirectional Wavelength Division Multiplexing (WDM) optical solution at the upcoming Optical Fiber Communication Conference (OFC) in San Diego on March 5-9, 2023.

Ayar Labs Partners with Department of Defense to Accelerate Transition to Optical I/O in Next-Gen Defense Applications
Project KANAGAWA granted to Ayar Labs with goal of transitioning optical Input/Output (I/O) into the Defense Industrial Base (DIB) while driving affordability and scalability for production…

Ayar Labs Expands Executive Team to Lead the Next Phase of Growth in Optical I/O Production and Broad Commercial Adoption
Ayar Labs, a leader in chip-to-chip optical connectivity, has expanded its executive team to further commercial development, with the addition of Lakshmikant (LK) Bhupathi, Vice President of Products, Strategy and Ecosystem, and Scott Clark, Vice President of Manufacturing and Operations…

Lockheed Martin, Ayar Labs Partner to Advance Microchip Connectivity for Next Generation Sensory Systems
Lockheed Martin, (NYSE: LMT) and Ayar Labs, a leader in chip-to-chip optical connectivity, today announced a strategic collaboration to develop…

Ayar Labs to Accelerate Development and Application of Optical Interconnects in Artificial Intelligence/Machine Learning Architectures with NVIDIA
Ayar Labs, the leader in chip-to-chip optical connectivity, is developing with NVIDIA groundbreaking artificial intelligence (AI) infrastructure based on optical I/O technology to meet future demands of…

Ayar Labs Raises $130 Million in Series C Funding, Accelerating Commercialization of Industry’s First In-Package Optical I/O Products

Lumentum And Ayar Labs Announce Strategic Collaboration To Supply External Light Sources For Co-Packaged Optical Interconnect Solutions
Join our mailing list
Recent News Coverage
U.S. silicon photonics chip startup Ayar Labs gets AI funding boost
Silicon Valley chip startup Ayar Labs raised another $25 million after its latest funding round closed, as demand has increased for faster, more energy-efficient computing for artificial intelligence applications, the company said on Wednesday.
Ayar Labs tops up funding with $25M
Ayar Labs, the Santa Clara developer of silicon photonics technology that is closely involved with some of the biggest names in computing and data centers, has topped up its funding by $25 million.
Yole: Leveraging optical chip-to-chip connectivity to unleash the complete potential of AI – An interview with Ayar Labs
Co-packaged optics (CPO) has gained attention recently due to its power efficiency in data centers. While most leading proponents of CPO targeting networking applications have discontinued CPO programs due to macroeconomic headwinds, the situation of CPO for artifical Intelligence (AI) and machine learning (ML) systems is different. AI models have an insatiable demand for computing power, storage, and data movement, and traditional architectures are becoming the main bottleneck for scaling ML.
More News Coverage →
Resources
GlobalFoundries & Ayar Labs: Delivering Optical I/O for the Continued Rise of Artificial Intelligence and Machine Learning
Dr. Anthony J. Yu, VP, silicon photonics product management, GlobalFoundries, examines Ayar Labs’ and GlobalFoundries’ long-term partnership and optical I/O product roadmap. Dr. Yu also addresses how Ayar Labs’ optical technology unlocks the compute power necessary for data-intensive applications like artificial intelligence and machine learning.
Ayar Labs Demonstrates Industry’s First 4-Tbps Optical Solution for Chip-to-Chip Connectivity
Here’s a peek at our 4-Tbps optical I/O solution demo as well as real customer assessment data comparing the commercial state-of-the art to Ayar Labs’ in-package optical I/O solution in terms of data throughput, power consumption, and footprint.
Webinar: Meeting the Bandwidth Demands of Next-Gen HPC & AI System Architectures
In artificial intelligence (AI), increasingly complex algorithms, larger datasets, and process-intensive workloads lend to an insatiable demand for compute, memory, and storage, as well as higher-bandwidth, lower-latency communication between these components.
More Resources →