Ayar Labs Selected as Optical Solution for Intel’s DARPA PIPES Project

Dec 9, 2019News

Santa Clara, CA, December 9, 2019 – Ayar Labs is pleased to announce that it has been selected by Intel to provide the Optical I/O solution for the company’s recently awarded DARPA PIPES research project. The goal of PIPES, which stands for Photonics in the Package for Extreme Scalability, is to develop in-package optical I/O solutions that significantly increase the amount of data that a chip can transmit (generally referred to as bandwidth) off-package at much lower power than conventional electrical I/O.

“Bringing optical connectivity all the way into the CPU/SOC package has long been one of the ‘Holy Grail’ projects in High Performance and Hyperscale Computing, as it unleashes the performance of ever more powerful computing and network processors and removes a major bottleneck and set of constraints in systems architecture and design,” said Charles Wuischpard, CEO of Ayar Labs, “Moreover, the energy consumed in moving data through a system is significant and growing, and the best way to manage that is to move the data optically from end to end. We are pleased to be selected by Intel as the optical solution for their DARPA PIPES project and look forward to a multi-year collaboration.”

“We’re seeing rapid growth of data-centric workloads with an insatiable demand for bandwidth and the need to connect devices at hyper-scale distances,” said Vince Hu, VP of Strategy and Innovation for Intel’s FPGA products.  “Optical interconnects are the ideal solution for many of these applications, and an optical I/O chiplet solution like the one provided by Ayar Labs for this project can achieve very high bandwidth at low latency and low power consumption.”

The TeraPHY™ chiplet is manufactured on GLOBALFOUNDRIES state-of-the-art 45nm platform, which enabled Ayar Labs to build a monolithic, single-die solution that integrates both electrical and optical photonic circuits and devices on a single chip.

“We have worked in close collaboration with Ayar Labs to deliver a new class of integrated electronic, photonics solutions,” said Anthony Yu, vice president of Computing and Wired Infrastructure at GF. “Going forward, we’re excited to work with the pioneers at Ayar Labs to continue disrupting the market by combining our next generation 45nm platform, targeted to future CMOS-based photonics solutions, with their differentiated technology that will push the limits of chip communication bandwidth for high-performance computing, cloud and AI applications.”

About Ayar Labs

Ayar Labs is disrupting the traditional performance, cost, and efficiency curves of the semiconductor and computing industries by driving a 1000x improvement in interconnect bandwidth density at 10x lower power.  Ayar Labs’ patented approach uses industry standard, cost-effective silicon processing techniques to develop high-speed, high-density, low-power optical interconnect “chiplets” and lasers to replace traditional electrical I/O.  The company was founded in 2015 and is funded by Playground Global and Founders Fund, as well as strategic investments from GLOBALFOUNDRIES, Intel Capital, and Lockheed Martin Ventures. For more information, please visit https://ayarlabs.com.


Media Contact:  Kristine Raabe, press@ayarlabs.com


Intel and the Intel logo are trademarks of Intel Corporation in the United States and/or other countries.

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