Ayar Labs Press Releases
Hewlett Packard Enterprise and Ayar Labs Announce Strategic Collaboration and Investment to Develop Next-Generation Data Center Architectures and Networking with Optical I/O
Ayar Labs Demonstrates Industry’s First Terabit Optical Link for Co-Packaged Optics and Chip-to-Chip Connectivity
Ayar Labs Demonstrates First Ultra-Dense Optical Interconnect Solution on GLOBALFOUNDRIES’ Next Generation Silicon Photonics Manufacturing Process
Ayar Labs Secures $35 Million in Series B Funding and Adds New Strategic and Global Investors as Interest in Optical I/O Grows
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Recent News Coverage
Computing demands for artificial intelligence are forcing chip makers to re-evaluate everything, from chip architecture to chip size to eke out better performance.
The communications industry has an I/O bottleneck problem. When data is unable to be moved into or out of a chip at a rate that matches or exceeds the rate at which processing occurs, a backlog is created in the data stream.
Optical interconnects have been potential solutions to the issue of interconnecting hundreds of I/O in dense electronics assemblies as requirements increase.
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Generative AI is enabling transformative outcomes, but model complexity is growing exponentially. Traditional interconnects create a bottleneck for data, forcing GPUs to remain idle a majority of the time.
4 Tbps Optical FPGA Technology from Intel and Ayar Labs: Spend Your Precious Power on Compute, Not Connectivity
Sergey Shumarayev, Intel senior principal engineer/distinguished architect, shares how optical FPGA technology addresses socket power challenges for data-intensive applications like generative AI.
Experience unmatched data transmission speeds. Intel’s optical FPGA integrated with Ayar Labs’ in-package optical I/O solution. See it at ERI and HOT CHIPS.
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