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It’s photons over electrons in effort to eek out better chip performance

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In-Package Optical I/O

Pushing the Boundaries of AI Architecture

Optical I/O is Essential to Eliminate Bottlenecks

Ayar Labs’ in-package optical I/O technology solves the problem of data transfer bottlenecks caused by traditional interconnects.

By letting nodes effectively function as a single, giant GPU, optical I/O powers today’s AI workloads — and tomorrow’s.

Maximizes compute efficiency and performance of AI infrastructure

Increases bandwidth, power efficiency, GPU/accelerator utilization

Reduces costs, latency, training time

Facilitates disaggregated architectures for efficient, scalable memory pooling

Faster Data by the Numbers

Bandwidth

5-10x

higher bandwidth

Power Efficiency

4-8x

more power efficient

Latency

10x

lower latency

(than traditional interconnects: pluggable optics+electrical SerDes)

Optical I/O for AI Architectures

Breakthrough Technology

Pioneered microring technology — core to optimal density, energy efficiency, and latency

Optimized for AI

Improves overall accelerator utilization, for increased compute efficiency and performance, which reduces CapEx and OpEx

Standards-Based, Commercial-Ready

Standards-based approach (UCIe, CXL, CW-WDM MSA) ensures easy integration and supports multiple connectivity protocols

Moving Data with Light

Ayar Labs’ Solution Combines Two Industry-First Technologies

Ayar Labs' Optical I/O Solution

TeraPHY™ In-Package Optical I/O Chiplet

  • Industry-first monolithic in-package optical I/O chiplet
  • Combines silicon photonics with standard CMOS manufacturing processes
  • Enables ASICs to communicate across a wide range of distances, from mm to km

SuperNova™ Multi-Wavelength Light Source

  • Industry-first multi-wavelength, multi-port optical source
  • Provides up to 16 wavelengths of light and powers up to 16 ports
  • First optical source designed to be compliant with the CW-WDM MSA specification

All in One

By integrating optical components directly into the package, in-package optical I/O offers many advantages over co-packaged optics that make it ideal for advanced AI designs:

Superior Link Density and Scalability

Enables seamless communication across distributed systems

Minimizes signal loss and latency, enhancing overall performance

Streamlined system design, lower power, and reduced costs

Delivers uniform latency when transmitting data across nodes

How is Optical I/O Different from Co-Packaged Optics?

The emergence of new types of optical interconnects is both exciting and, at times, confusing — especially when it comes to differentiating between optical I/O and co-packaged optics (CPO). Each option is a distinct strategy with clear and significant tradeoffs.

CPO, primarily designed for large Ethernet network switches, is a replacement for pluggable optics.

Optical I/O, on the other hand, is a chiplet-based optical interconnect integrated in the same package with compute chips (ASICs, FPGAs, XPUs). This integration facilitates seamless communication in distributed compute systems, boasting bandwidth density, energy cost, and latency comparable to in-package electrical interconnects.

For a detailed comparison of co-packaged optics and in-package optical I/O, read our blog,
InPackage Optical I/O versus Co-Packaged Optics Let’s Get Technical!

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