Ayar Labs Co-founder and CEO, Mark Wade, and VP of Capital Strategy and Investor Relations, Jesse R. Leiter, joined Ben Bajarin and Jay Goldberg on The Circuit to discuss solving the interconnect bottleneck in large-scale AI data centers by transitioning to optical connectivity.
Mark and Jesse also get into how the company has been capitalized for that timeline: $650 million raised in 2026, structured deliberately against a scale-up optics market projected to approach tens of billions.
Additional $150 million in capital supports product development, manufacturing ecosystem readiness, high-volume production, and new Bengaluru Design Center in India
Ayar Labs, the leader in co-packaged optics (CPO) solutions for AI scale-up, announced the appointment of Sejal Daswani as Chief People and Operations Officer.
Enables hyperscalers to scale with high-bandwidth, low-latency, power-efficient optical connectivity
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The CPO revolution is at our doorstep. But transforming data center interconnects requires overcoming new challenges in architecture, power delivery, mechanical design, and thermal management. Of these, thermal management has emerged as one of the most critical areas for successfully deploying co-packaged optics (CPO) in hyperscale AI environments.
Co-packaged optics is emerging as the only solution capable of delivering the bandwidth density and efficiency that multi-rack scale-up demands.
Co-packaged optics is at an inflection point. We see it rapidly transitioning from proof-of-concept prototypes to manufacturable systems.
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