Learn more about optical connectivity
Demonstration of Ayar Labs’ Optical I/O Multi-Chip Package and Single-Die Package solutions
Our longstanding relationship with DARPA has helped us to achieve a first-of-its-kind demonstration where we have implemented our CMOS-based optical I/O TeraPHY™ chiplets inside the same package as an advanced SOC. More resources from Ayar Labs:
Paradigm Change: Reinventing HPC Architectures with In-Package Optical I/O
Even with the first exascale systems just around the corner, HPC centers are already wrestling with what technologies will provide the next level of compute performance, bandwidth and memory to continue to advance their science. And while some CPU/GPU manufacturers...
Investing in our Vision to Make In-Package Optical I/O a Reality
Discover what Ayar Labs has accomplished in the 2nd quarter of 2020, during these unprecedented times. From opening a new office and the purchase of a new wafer prober to the formation of the CW-WDM MSA and new product demonstration milestones, Ayar Labs has been...
TeraPHY: An O-band WDM Electro-optic Platform for Low Power, Terabit/s Optical I/O
Abstract: We demonstrate an electro-optic platform enabling a direct optical I/O interface in an ASIC package. The 5.5x8.9mm 2 chiplet uses the Advanced Interface Bus (AIB), a parallel digital interface, to communicate to a host ASIC and integrates high-speed...
Ayar Labs: Solving Critical Computing Challenges through Optical I/O
Discover how our optical I/O solution will solve the critical computing challenges of efficiency, density, and distance for next-gen system architectures.
Technical Brief: Optical I/O Chiplets Eliminate Bottlenecks to Unleash Innovation
This technical brief examines the evolution of optical communications in computing systems and the transition to ‘Phase Two’ of Moore’s Law through monolithic in-package optical I/O (MIPO I/O). Trends Driving Monolithic In-Package Optical Input/Output Chiplets...