Learn more about optical connectivity
In-Package Optical I/O: On the Cusp of High Volume Manufacturing
Ayar Labs has successfully demonstrated the first ultra-dense optical interconnect solution on GLOBALFOUNDRIES’ next generation silicon photonics manufacturing process. With this demonstration, we're showing that optical I/O is ready to be manufactured in high...
Webinar: Disaggregated System Architectures for Next Generation HPC and AI Workloads
As scientific applications and workflows incorporate AI models, new opportunities for innovation in system architectures are created to increase post-exascale computing capabilities. Disaggregated architectures that decouple memory from processors and accelerators...
Demonstration of Ayar Labs’ Optical I/O Multi-Chip Package and Single-Die Package solutions
Our longstanding relationship with DARPA has helped us to achieve a first-of-its-kind demonstration where we have implemented our CMOS-based optical I/O TeraPHY™ chiplets inside the same package as an advanced SOC. More resources from Ayar Labs:
Paradigm Change: Reinventing HPC Architectures with In-Package Optical I/O
Even with the first exascale systems just around the corner, HPC centers are already wrestling with what technologies will provide the next level of compute performance, bandwidth and memory to continue to advance their science. And while some CPU/GPU manufacturers...
Investing in our Vision to Make In-Package Optical I/O a Reality
Discover what Ayar Labs has accomplished in the 2nd quarter of 2020, during these unprecedented times. From opening a new office and the purchase of a new wafer prober to the formation of the CW-WDM MSA and new product demonstration milestones, Ayar Labs has been...
TeraPHY: An O-band WDM Electro-optic Platform for Low Power, Terabit/s Optical I/O
Abstract: We demonstrate an electro-optic platform enabling a direct optical I/O interface in an ASIC package. The 5.5x8.9mm 2 chiplet uses the Advanced Interface Bus (AIB), a parallel digital interface, to communicate to a host ASIC and integrates high-speed...