Scaling AI infrastructure requires innovation beyond compute cores, especially in interconnects and memory. This presentation from the 2025 TSMC OIP Ecosystem Forum details how the combination of Ayar Labs’ co-packaged optics (CPO) and Alchip’s advanced packaging enables breakthrough system architectures that significantly boost AI performance and profitability. The partnership leverages TSMC’s advanced technologies to make high-performance CPO solutions more accessible and drive the adoption of this transformative technology.
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