Integrating silicon photonics platforms with advanced electronics leverages transistor performance, process fidelity and package integration to enable a new class of systems-on-a-chip. This silicon photonics technology can be used for a variety of applications ranging from computing and communications to sensing and imaging. Monolithic silicon photonics is a promising solution to meet the energy efficiency, sensitivity, and cost requirements of these applications.

In this review paper, we take a comprehensive view of the performance of the silicon-photonic technologies developed to date for photonic interconnect applications. We also present the latest performance results of our “zero-change” silicon photonics platforms in 45 nm and 32 nm SOI CMOS. The results indicate that the 45 nm and 32 nm processes provide a “sweet-spot” for adding photonic capabilities and enhancing integrated system applications beyond the Moore-scaling. At the same time, these processes are able to offload major communication tasks from more deeply-scaled compute and memory chips without complicated 3D integration approaches.


Vladimir Stojanovic, Rajeev J. Ram, Milos Popovic, Sen Lin, Sajjad Moazeni, Mark Wade, Chen Sun, Luca Alloatti, Amir Atabaki, Fabio Pavanello, Nandish Mehta, and Pavan Bhargava

Published In: OSA Publishing


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