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TeraPHY: An O-band WDM Electro-optic Platform for Low Power, Terabit/s Optical I/O
Abstract: We demonstrate an electro-optic platform enabling a direct optical I/O interface in an ASIC package. The 5.5x8.9mm 2 chiplet uses the Advanced Interface Bus (AIB), a parallel digital interface, to communicate to a host ASIC and integrates high-speed...
Ayar Labs: Solving Critical Computing Challenges through Optical I/O
Discover how our optical I/O solution will solve the critical computing challenges of efficiency, density, and distance for next-gen system architectures.
Technical Brief: Optical I/O Chiplets Eliminate Bottlenecks to Unleash Innovation
This technical brief examines the evolution of optical communications in computing systems and the transition to ‘Phase Two’ of Moore’s Law through monolithic in-package optical I/O (MIPO I/O). Trends Driving Monolithic In-Package Optical Input/Output Chiplets...
Ayar Labs TeraPHY™ MIPO I/O Chiplet: Enhancing state of the art, advanced architectures
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TeraPHY: A Chiplet Technology for Low-Power, High-Bandwidth In-Package Optical I/O
Abstract: This slide deck was presented by Mark Wade on August 20, 2019. (48 slides) Authors: Ayar Labs - Dr. Mark Wade, Erik Anderson, Dr. Shahab Ardalan, Pavan Bhargava, Sidney Buchbinder, Dr. Michael Davenport, Dr. John Fini, Dr. Anatoly Khilo, Roy Meade, Dr....
TeraPHY: A High-density Electronic-Photonic Chiplet for Optical I/O from a Multi-Chip Module
In this work, we provide an overview of System-in-Package (SiP) integration of an electronic-photonic chiplet fabricated in a commercial CMOS foundry. Assembly considerations, including co-packaging in a standard multi-chip module (MCM) package with a System-on-Chip (SoC), thermals, and fiber attach will be reviewed.