Silicon Photonics and Heterogeneous Integration Challenges

Mar 15, 2021 | Presentation, Resources, Video

In this recorded presentation, Roy Meade, VP of Manufacturing at Ayar Labs, shares how materials engineering can impact the cost and performance of silicon photonics products, with specifics on in-package photonics. Roy details the four development areas of in-package photonics: Platform, Test, Fiber and Ecosystem.

Pin It on Pinterest

Share This