In-Package
Optical I/O Solutions
Redefining Data Transfer:
Harness the Power of In-Package Optical I/O for Next-Gen Connectivity and Power Efficiency
Eliminating Electrical I/O Bottlenecks and Unlocking Unprecedented Performance and Efficiency
As the semiconductor industry embraces the chiplet revolution, Ayar Labs’ in-package optical I/O solution is redefining I/O capabilities. Our TeraPHY™ in-package optical I/O chiplet and SuperNova™ light source combine to deliver an I/O solution that obliterates electrical I/O bottlenecks and process constraints, unlocking new architectures for artificial intelligence/machine learning (AI/ML), disaggregated data centers, 6G, phased array sensory systems, and more.
Key Benefits:
Bandwidth: 4 Tbps bi-directional
Power efficiency: less than 5pJ/b (10 Watts)
Latency: 5ns per chiplet + TOF
Reach: from mm to km
TeraPHY™ Optical I/O Chiplet
Merges silicon photonics with standard high-volume CMOS manufacturing processes to deliver bandwidth density of 200 Gbps/mm today with a roadmap to Tbps/mm.
SuperNova™ Remote Light Source
CW-WDM MSA-compliant external light source module that provides up to 16 wavelengths of light and powers up to 16 ports. It delivers optical energy to TeraPHY chiplets, providing 5x higher data rates while being 8x more power efficient.
Together, TeraPHY chiplets and the SuperNova light source provide a range of configuration options, such as:
• Combining them on a single printed circuit board
• Integrating multiple TeraPHY chiplets within one package with an ASIC, FPGA, CPU, GPU, or other processor
- Placing multi-chip packages on a shared board
- Positioning SuperNova modules on a dedicated board or rack to enable chiplets to be distributed across data center racks
In-Package Optical I/O: Unleashing Innovation
Companies and institutions across diverse use cases confront shared power, performance, and latency hurdles that call for the adoption of optical I/O solutions.
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Artificial Intelligence
Ayar Labs’ optical I/O solution offers the bandwidth density, power efficiency, and low latency required to connect distributed accelerator networks. This empowers AI systems to tackle increasingly complex tasks.
• 5x higher data rates
• 8x more power efficient
• 10x lower latency
Cloud and Data Center
Ayar Labs’ technology overcomes the limitations of traditional server architectures and enables powerful rack-scale solutions. Optical I/O’s power efficiency, low latency, and reach reshape performance, cost, and efficiency curves for faster innovation.
• 8x more power efficient
• 10x lower latency
• From mm to km reach
High Performance
ComputingOur optical I/O solution overcomes transistor density limits, enabling performance improvements and more flexible, disaggregated architectures at eight times the power efficiency versus copper-based data solutions.
• 10x lower latency
• 5x higher data rates
• 8x more power efficient
Aerospace
and Intelligent EdgeOur optical I/O solution addresses size, weight, and power (SWaP) requirements for new mil-aero applications. It is also immune to electromagnetic interference (EMI) and reaches from mm to km. These features enable new on-board sensing architectures and higher-density radar arrays.
- EMI immune
- Very compact package
- 8x more power efficient
- 10x lower latency
Telecommunications
Our optical I/O solution replaces copper cables for high-bandwidth, low-power, long-reach connectivity in a very compact package. Ayar Labs’ technology supports the evolving 5G ecosystem by delivering fast, high-bandwidth connectivity required for processing and distributing data at the edge.
- Up to tens of Tbps throughput at less than 5pJ/b
- From mm up to km reach
- 8x more power efficient
“Today, we know what technologies are necessary for the first and second generation of exascale platforms in the 2022 to 2023 timeframe, but after that a crossover to optical I/O-based solutions will be needed.”
Matt Leininger, Deputy for Advanced Technology Projects, Lawrence Livermore National Laboratory
How is Optical I/O Different from Co-Packaged Optics?
The emergence of new types of optical interconnects is both exciting and, at times, confusing — especially when it comes to differentiating between optical I/O (OIO) and co-packaged optics (CPO). Each option is a distinct strategy with clear and significant tradeoffs.
CPO, primarily designed for large Ethernet network switches, is a replacement for pluggable optics.
Optical I/O, on the other hand, is a chiplet-based optical interconnect integrated in the same package with compute chips (ASICs, FPGAs, XPUs). This integration facilitates seamless communication in distributed compute systems, boasting bandwidth density, energy cost, and latency comparable to in-package electrical interconnects.
For a detailed comparison of co-packaged optics and in-package optical I/O, read our blog, In-Package Optical I/O versus Co-Packaged Optics – Let’s Get Technical!.
