TeraPHY: A High-Density Electronic-Photonic Chiplet for Optical I/O from a Multi-Chip Module

Abstract:

In this technical paper, we provide an overview of System-in-Package (SiP) integration of an electronic-photonic chiplet fabricated in a commercial CMOS foundry. Assembly considerations—including co-packaging in a standard multi-chip module (MCM) package with a System-on-Chip (SoC), thermals, and fiber attach—will be reviewed.

Authors:

Roy Meade, Shahab Ardalan, Michael Davenport, John Fini, Chen Sun, Mark Wade, Alexandra Wright-Gladstein, and Chong Zhang

Published In: Optical Fiber Communication Conference 2019