In-Package Optical I/O: Unleashing Innovation

The CPO revolution is at our doorstep. But transforming data center interconnects requires overcoming new challenges in architecture, power delivery, mechanical design, and thermal management. Of these, thermal management has emerged as one of the most critical areas for successfully deploying co-packaged optics (CPO) in hyperscale AI environments.

Co-packaged optics is emerging as the only solution capable of delivering the bandwidth density and efficiency that multi-rack scale-up demands.

Co-packaged optics is at an inflection point. We see it rapidly transitioning from proof-of-concept prototypes to manufacturable systems.