In this work, we provide an overview of System-in-Package (SiP) integration of an electronic-photonic chiplet fabricated in a commercial CMOS foundry. Assembly considerations, including co-packaging in a standard multi-chip module (MCM) package with a System-on-Chip (SoC), thermals, and fiber attach will be reviewed.
In this review paper, we take a comprehensive view of the performance of the silicon-photonic technologies developed to date for photonic interconnect applications. We also present the latest performance and results of our “zero-change” silicon photonics platforms in 45 nm and 32 nm SOI CMOS.
The next generations of large-scale data-centers and supercomputers demand optical interconnects to migrate to 400G and beyond. Microring modulators in silicon-photonics VLSI chips are promising devices to meet this demand due to their energy efficiency and compatibility with dense wavelength division multiplexed chip-to-chip optical I/O.
WaveLight: A Monolithic Low Latency Silicon-Photonics Communication Platform for the Next-Generation Disaggregated Cloud Data Centers
In this work, we present WaveLight, a monolithic silicon-photonics platform whereby a low latency reliable deterministic protocol with optical functions are designed directly into an existing high-volume CMOS process.